Haɗin zafin jiki tare da HK501-SP05C

Abu mai suna: Thermal Compound

Lambar samfurin: HK501-SP05C

Abu Saukewa: HK501 Naúrar
Launi GRAYYA No
Thermal Conductivity : 1.53 W/mK
Thermal Impedance 0.238 ℃-in²/W
Takamaiman Nauyi 2.06 g/cm³
Thixotropic Index 360± 10 1/10 mm
Zazzabi Mai Ciki Lokacin -30 ~ 240 ℃
Yanayin Aiki -25 ~ 200 ℃

 

 

 


Cikakken Bayani

Tags samfurin

Haɗaɗɗen thermal

Abu:CPU Thermal Compound Heatsink Manna

Zazzabi na aikace-aikacen: -50 zuwa 150

Brand Name: Cooler Hekang

Shigar mazugi:240 ± 25

CAS No.: 63148-62-9

Amfani: LED/PCB/CPU

Rarraba Sauran: Adhesives

Launi: Launi na musamman akwai

HK500 jerin Thermal man shafawa, mafi kyau sanyaya yi tare da high thermal conductivity graphite da foda. Ya kamata a yi amfani da wannan man shafawa na thermal don cike giɓi da faɗaɗa wurin sanyaya tsakanin rukunin dumama da matattarar zafi. Samun takaddun shaida na RoHS & CE & REACH.

Yawancin nau'ikan fakiti tare da ma'auni daban-daban don cika cika buƙatun ku iri-iri.


  • Na baya:
  • Na gaba:

  • Ku rubuta sakonku anan ku aiko mana