Thermal Compound nrog HK501-SP05C

Thermal Compound

Yam khoom: CPU Thermal Compound Heatsink Paste

Kev siv kub: -50 ~ 150

Hom Lub Npe: Cooler Hekang

Cone nkag mus: 240 ± 25

CAS Nr .: 63148-62-9

Kev siv: LED / PCB / CPU

Classification Lwm yam: Adhesives

Xim: Kev cai xim muaj

HK500 series Thermal Grease, kev ua kom txias zoo dua nrog cov thermal conductivity graphite thiab hmoov. Cov roj thermal no yuav tsum tau siv los sau qhov khoob thiab nthuav qhov chaw txias ntawm chav tsev cua sov thiab lub dab dej kub. Muaj RoHS & CE & REACH tau ntawv pov thawj.

Ntau hom pob ntawv nrog qhov hnyav sib txawv kom ua tiav koj cov kev xav tau sib txawv.