Ngwakọta ọkụ na HK501-SP05C

Ngwakọta okpomọkụ

Ihe:CPU Thermal Compound Heatsink Tapawa

Ngwa okpomọkụ: -50 ruo 150

Aha ika: cooler Hekang

Ntinye cone:240 ± 25

CAS Nọmba: 63148-62-9

Ojiji: LED/PCB/CPU

Nhazi Ndị ọzọ:Adhesives

Agba: Agba nkeonwe dị

HK500 usoro Thermal Grease, arụmọrụ dị mma ka mma yana graphite conductivity dị elu na ntụ ntụ. Ekwesịrị iji mmanụ a na-ekpo ọkụ mejupụta oghere na ịgbasa ebe jụrụ oyi n'etiti nkeji kpo oku na ikpo ọkụ. Nweta asambodo RoHS & CE & REACH.

Ọtụtụ ụdị ngwugwu nwere nha dị iche iche iji mejupụta ihe dị iche iche chọrọ.