Thermal Compound yokhala ndi HK501-SP05C

Dzina lachinthu: Thermal Compound

Chithunzi cha HK501-SP05C

Kanthu Chithunzi cha HK501 Chigawo
Mtundu GULU No
Thermal Conductivity >1.53 W/mK
Thermal Impedance <0.238 ℃-mu²/W
Specific Gravity 2.06 g/cm³
Thixotropic Index 360 ± 10 1/10 mm
Moment Beared Temperature -30 ~ 240 ℃
Kutentha kwa Ntchito -25-200 ℃

 

 

 


Tsatanetsatane wa Zamalonda

Zolemba Zamalonda

Thermal Compound

Katunduyo: CPU Thermal Compound Heatsink Paste

Kugwiritsa ntchito kutentha: -50 mpaka 150

Dzina la Brand: Cooler Hekang

Kulowa kwa koni: 240 ± 25

Nambala ya CAS: 63148-62-9

Kugwiritsa ntchito: LED/PCB/CPU

Gulu Zina: Zomatira

Mtundu: Mtundu wamakonda ulipo

HK500 mndandanda Thermal Grease, kuziziritsa bwino ntchito ndi mkulu matenthedwe madutsidwe graphite ndi ufa. Mafuta otenthawa ayenera kugwiritsidwa ntchito kudzaza mipata ndi kukulitsa malo ozizira pakati pa chotenthetsera ndi chotengera cha kutentha. Khalani ndi RoHS & CE & REACH certification.

Mitundu yambiri yamaphukusi okhala ndi zolemera zosiyanasiyana kuti mudzaze zofunika zanu zosiyanasiyana.


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