Fa'a mafanafana ma le HK501-SP05C

Igoa mea: Thermal Compound

Numera Fa'ata'ita'iga:HK501-SP05C

Aitema Fa'ata'ita'iga:HK501 Vaega
Lanu LANU EFUEFU No
Amioga vevela >1.53 W/mK
Fa'avevela Fa'avevela <0.238 ℃-i²/W
Gravity Fa'apitoa 2.06 g/cm³
Thixotropic Index 360±10 1/10mm
Taimi Tumau Temperature -30~240 ℃
Temperature Gaioiina -25~200 ℃

 

 

 


Fa'amatalaga Oloa

Faailoga o oloa

Fa'ameavela

Mea: CPU Thermal Compound Heatsink Paste

Fa'aoga vevela: -50 i le 150

Igoa igoa: Cooler Hekang

Tu'u i totonu:240 ± 25

CAS Nu.:63148-62-9

Fa'aoga:LED/PCB/CPU

Fa'avasegaina Isi: Fa'apipi'i

Lanu: Lanu fa'apitoa e maua

HK500 series Thermal Grease, sili atu le fa'amafanafanaga fa'atasi ai ma le maualuga o le fa'avevela vevela kalafi ma le pa'u. E tatau ona fa'aoga lenei ga'o vevela e fa'atumu ai gaogao ma fa'alautele ai le vaega mālūlū i le va o le fa'avevela ma le fa'a'alili. Faʻamaonia le RoHS & CE & REACH.

Le tele o ituaiga afifi ma eseese mamafa e faʻatumu atoa ai au manaʻoga eseese.


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