Thermal Compound ine HK501-SP05C

Thermal Compound

Chinhu:CPU Thermal Compound Heatsink Paste

Kushanda tembiricha: -50 kusvika 150

Zita reBrand: Cooler Hekang

Koni kupinda:240 ± 25

Nhamba yeCAS: 63148-62-9

Kushandisa: LED/PCB/CPU

Classification Zvimwe: Adhesives

Muvara:Muvara wetsika unowanikwa

HK500 yakatevedzana Thermal Girisi, kuita zvirinani kutonhora nepamusoro yekupisa conductivity graphite nehupfu. Iri girisi rinopisa rinofanirwa kushandiswa kuzadza mapundu uye kuwedzera nzvimbo yekutonhora pakati pekudziya unit uye singi yekupisa. Iva neRoHS & CE & REACH yakasimbiswa.

Mazhinji marudzi emapakeji ane huremu hwakasiyana kuti azere kuzadza zvaunoda zvakasiyana.