Motsoako oa Thermal le HK501-SP05C

Lebitso la ntho: Thermal Compound

Nomoro ea mohlala: HK501-SP05C

Ntho Mohlala: HK501 Yuniti
Mmala MOPUTSO No
Thermal Conductivity = 1.53 W/mK
Thermal Impedance Setšoantšo sa 10.238 ℃-in²/W
Matla a Khoheli a khethehileng 2.06 g/cm³
Thixotropic Index 360±10 1/10 limilimithara
Moment Beared Temperature -30 ~ 240 ℃
Mocheso oa Ts'ebetso -25 ~ 200 ℃

 

 

 


Lintlha tsa Sehlahisoa

Li-tag tsa Sehlahisoa

Motsoako oa Mocheso

Ntho: CPU Thermal Compound Heatsink Paste

Mocheso oa kopo: -50 ho isa ho 150

Lebitso la Brand: Cooler Hekang

Ho kenella ha khoni: 240 ± 25

Nomoro ea CAS: 63148-62-9

Tšebeliso: LED/PCB/CPU

Sehlopha se seng: Likhomaretsi

Mmala:Mmala o ikgethang o teng

HK500 letoto la Thermal Grease, ts'ebetso e ntle ea ho pholisa e nang le graphite e phahameng ea mocheso le phofo. Setlolo sena sa mocheso se lokela ho sebelisoa ho tlatsa likheo le ho atolosa sebaka sa ho pholisa pakeng tsa mocheso oa mocheso le mocheso oa mocheso. E na le setifikeiti sa RoHS & CE & REACH.

Mefuta e mengata ea liphutheloana tse nang le boima bo fapaneng ho tlatsa litlhoko tsa hau tse fapaneng.


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