I-Thermal Compound ene-HK501-SP05C

I-Thermal Compound

Into:CPU Thermal Compound Heatsink Paste

Ubushushu besicelo: -50 ukuya kwi-150

Igama leBrand: Cooler Hekang

Ukungena kweKhowuni: 240 ± 25

Inombolo yeCAS: 63148-62-9

Ukusetyenziswa: LED/PCB/CPU

Ulwahlulo Olunye:Izinto zokuncamathelisa

Umbala:Umbala olungiselelweyo uyafumaneka

HK500 series Thermal Grease, ukusebenza ngcono ukupholisa kunye high conductivity thermal graphite kunye nomgubo. Le grisi ye-thermal kufuneka isetyenziswe ukuvala izithuba kunye nokwandisa indawo yokupholisa phakathi kweyunithi yokufudumeza kunye ne-heat sink. Yiba ne-RoHS & CE & FIKELEKA isiqinisekiso.

Iindidi ezininzi zeepakethi ezinobunzima obahlukeneyo ukuzalisa ngokupheleleyo iimfuno zakho ezahlukeneyo.