I-Thermal Compound ene-HK501-SP05C

I-Thermal Compound

Into:CPU Thermal Compound Heatsink Namathisela

Ukushisa kwesicelo: -50 kuya ku-150

Igama Brand: Cooler Hekang

Ukungena kwekhoni:240 ± 25

Inombolo ye-CAS: 63148-62-9

Ukusetshenziswa: I-LED/PCB/CPU

Izigaba Okunye:Izinamathiselo

Umbala:Umbala wangokwezifiso uyatholakala

I-HK500 uchungechunge lwe-Thermal Grease, ukusebenza okungcono kokupholisa okune-graphite ephezulu ye-thermal conductivity kanye nempushana. Lawa mafutha ashisayo kufanele asetshenziselwe ukugcwalisa izikhala futhi andise indawo yokupholisa phakathi kweyunithi yokushisisa kanye nosinki wokushisa. Yiba ne-RoHS & CE & REACH eqinisekisiwe.

Izinhlobo eziningi zamaphakheji anesisindo esihlukile ukuze agcwalise ngokugcwele izidingo zakho ezihlukene.