Thermal Compound with HK501-SP05C

Thermal Compound

Item:CPU Thermal Compound Heatsink Paste

Application temperature: -50 to 150

Brand Name:Cooler Hekang

Cone penetration:240 ± 25

CAS No.:63148-62-9

Usage:LED/PCB/CPU

Classification Other:Adhesives

Color:Custom color available

HK500 series Thermal Grease, better cooling performance with high thermal conductivity graphite and powder. This thermal grease should be used to fill the gaps and expand cooling area between heating unit and the heat sink. Have RoHS & CE & REACH certified.

Many types of packages with different weights to full fill your diversified requirements.